Texas Instruments LM74CIMX-3/NOPB

LM74CIMX-3-NOPB Texas Instruments LM74CIMX-3/NOPB
Texas Instruments

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Sensing Temperature - Remote:
-
Operating Temperature:
-55°C ~ 150°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Accuracy - Highest (Lowest):
1.25°C (±5°C)
Sensor Type:
Digital, Local
REACH Status:
REACH Unaffected
Output Type:
SPI
edacadModel:
LM74CIMX-3/NOPB Models
edacadModelUrl:
/en/models/367327
Test Condition:
-10°C ~ 65°C (-55°C ~ 150°C)
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Sensing Temperature - Local:
-55°C ~ 150°C
standardLeadTime:
6 Weeks
Resolution:
12 b
Features:
Shutdown Mode
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Voltage - Supply:
3V ~ 5.5V
Base Product Number:
LM74
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LM74CIMX-3/NOPB. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The product has -55°c ~ 150°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). While the highest and lowest accuracy level includes 1.25°c (±5°c). These sensors are sort of digital, local. In addition, it is reach unaffected. Furthermore, it has aspi output. Test condition included -10°c ~ 65°c (-55°c ~ 150°c). It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The local sensing temperature of the product is -55°c ~ 150°c. It has a long 6 weeks standard lead time. Features 12 b resolution. The splendid features of the product include shutdown mode. The product is available in surface mount configuration. 8-soic is the supplier device package value. It has optimum voltage supply of 3v ~ 5.5v. Moreover, it corresponds to lm74, a base product number of the product. The product is designated with the ear99 code number.

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Assembly Process 05/May/2021(PCN Assembly/Origin)
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SOIC Pkg Wire Bonding Update 24/Jul/2013(PCN Design/Specification)
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SOIC Pkg Wire Bonding 20/Mar/2013(PCN Design/Specification)

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