Intel AGFA019R25A2E3E

Intel

Product Information

HTSUS:
8542.31.0070
Number of I/O:
480
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
title:
AGFA019R25A2E3E
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer:
Intel
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
MPU, FPGA
standardLeadTime:
26 Weeks
Flash Size:
-
Series:
Agilex F
Primary Attributes:
FPGA - 1.9M Logic Elements
Supplier Device Package:
-
Packaging:
Tray
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed:
1.4GHz
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This is manufactured by Intel. The manufacturer part number is AGFA019R25A2E3E. It is assigned with possible HTSUS value of 8542.31.0070. 480 is the I/O value of the product. The product has 0°c ~ 100°c (tj) operating temperature range. The product has typical 256kb RAM size. It has supplied with other peripherals, such as dma, wdt. It provides connectivity solutions through ebi/emi, ethernet, i2c, mmc/sd/sdio, spi, uart/usart, usb otg. The intel's product offers user-desired applications. Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as mpu, fpga. It has a long 26 weeks standard lead time. The product agilex f, is a highly preferred choice for users. Primary Attributes of the Product: fpga - 1.9m logic elements. In addition, tray is the available packaging type of the product. quad arm® cortex®-a53 mpcore™ with coresight™, arm neon, floating point is the product's core processor. It has a robust speed of 1.4ghz.

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Guidelines Update 12/APR/2023(PCN Other)
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Mult Dev Design 09/May/2024(PCN Design/Specification)
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Mult Dev Label Chgs 15/Apr/2024(PCN Packaging)
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Mult DEV Barcode Label 04/Oct/2024(PCN Packaging)

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