AMD XCVM1302-1LSENSVF1369

XCVM1302-1LSENSVF1369 AMD
AMD

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
424
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1369-BFBGA
RAM Size:
256KB
Peripherals:
DDR, DMA, PCIe
Primary Attributes:
Versal™ Prime FPGA, 70k Logic Cells
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package:
Tray
Moisture Sensitivity Level (MSL):
4 (72 Hours)
Architecture:
MPU, FPGA
Flash Size:
-
Series:
Versal™ Prime
Supplier Device Package:
1369-BGA (35x35)
Core Processor:
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed:
600MHz, 1.3GHz
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This is manufactured by AMD. The manufacturer part number is XCVM1302-1LSENSVF1369. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 424 is the I/O value of the product. The product has 0°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 1369-bfbga. The product has typical 256kb RAM size. It has supplied with other peripherals, such as ddr, dma, pcie. Primary Attributes of the Product: versal™ prime fpga, 70k logic cells. It provides connectivity solutions through canbus, ebi/emi, ethernet, i²c, mmc/sd/sdio, spi, uart/usart, usb otg. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). The product has been designed as mpu, fpga. The product versal™ prime, is a highly preferred choice for users. 1369-bga (35x35) is the supplier device package value. dual arm® cortex®-a72 mpcore™ with coresight™, dual arm®cortex™-r5f with coresight™ is the product's core processor. It has a robust speed of 600mhz, 1.3ghz.

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