AMD XCZU3CG-2UBVA530I

XCZU3CG-2UBVA530I AMD
AMD

Product Information

HTSUS:
8542.31.0070
RoHS Status:
ROHS3 Compliant
Number of I/O:
82
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
530-WFBGA, FCBGA
RAM Size:
256KB
Peripherals:
DMA, WDT
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer:
AMD
Moisture Sensitivity Level (MSL):
4 (72 Hours)
Architecture:
MPU, FPGA
standardLeadTime:
26 Weeks
Flash Size:
-
Series:
-
title:
XCZU3CG-2UBVA530I
Supplier Device Package:
530-FCBGA (16x9.5)
Packaging:
Tray
Core Processor:
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed:
533MHz, 1.3GHz
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This is manufactured by AMD. The manufacturer part number is XCZU3CG-2UBVA530I. It is assigned with possible HTSUS value of 8542.31.0070. The product is rohs3 compliant. 82 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 530-wfbga, fcbga. The product has typical 256kb RAM size. It has supplied with other peripherals, such as dma, wdt. Primary Attributes of the Product: zynq®ultrascale+™ fpga, 154k+ logic cells. It provides connectivity solutions through canbus, ebi/emi, ethernet, i2c, mmc/sd/sdio, spi, uart/usart, usb otg. The amd's product offers user-desired applications. Its typical moisture sensitivity level is 4 (72 hours). The product has been designed as mpu, fpga. It has a long 26 weeks standard lead time. 530-fcbga (16x9.5) is the supplier device package value. In addition, tray is the available packaging type of the product. dual arm® cortex®-a53 mpcore™ with coresight™, dual arm®cortex™-r5 with coresight™ is the product's core processor. It has a robust speed of 533mhz, 1.3ghz.

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