AMD Xilinx XAZU3EG-L1SFVA625I

XAZU3EG-L1SFVA625I AMD Xilinx
AMD Xilinx

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
128
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
625-BFBGA, FCBGA
RAM Size:
1.8MB
Peripherals:
DMA, WDT
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity:
CANbus, I²C, SPI, UART/USART, USB
Package:
Tray
Moisture Sensitivity Level (MSL):
4 (72 Hours)
Architecture:
MPU, FPGA
standardLeadTime:
35 Weeks
Flash Size:
-
Series:
Zynq® UltraScale+™ MPSoC EG
Supplier Device Package:
625-FCBGA (21x21)
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed:
500MHz, 1.2GHz
Base Product Number:
XAZU3
ECCN:
5A002A4 XIL
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This is manufactured by AMD Xilinx. The manufacturer part number is XAZU3EG-L1SFVA625I. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 128 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 625-bfbga, fcbga. The product has typical 1.8mb RAM size. It has supplied with other peripherals, such as dma, wdt. Primary Attributes of the Product: zynq®ultrascale+™ fpga, 154k+ logic cells. It provides connectivity solutions through canbus, i²c, spi, uart/usart, usb. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). The product has been designed as mpu, fpga. It has a long 35 weeks standard lead time. The product zynq® ultrascale+™ mpsoc eg, is a highly preferred choice for users. 625-fcbga (21x21) is the supplier device package value. quad arm® cortex®-a53 mpcore™ with coresight™, dual arm®cortex™-r5 with coresight™, arm mali™-400 mp2 is the product's core processor. It has a robust speed of 500mhz, 1.2ghz. Moreover, it corresponds to xazu3, a base product number of the product. The product is designated with the 5a002a4 xil code number.

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Xilinx REACH211 Cert(Environmental Information)

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