AMD Xilinx XC7Z007S-1CLG225I

XC7Z007S-1CLG225I AMD Xilinx
AMD Xilinx

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
54
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
225-LFBGA, CSPBGA
RAM Size:
256KB
Peripherals:
DMA
Primary Attributes:
Artix™-7 FPGA, 23K Logic Cells
REACH Status:
REACH Unaffected
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
MCU, FPGA
standardLeadTime:
44 Weeks
Flash Size:
-
Series:
Zynq®-7000
Supplier Device Package:
225-CSPBGA (13x13)
Core Processor:
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed:
667MHz
Base Product Number:
XC7Z007
ECCN:
3A991D
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This is manufactured by AMD Xilinx. The manufacturer part number is XC7Z007S-1CLG225I. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 54 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 225-lfbga, cspbga. The product has typical 256kb RAM size. It has supplied with other peripherals, such as dma. Primary Attributes of the Product: artix™-7 fpga, 23k logic cells. In addition, it is reach unaffected. It provides connectivity solutions through canbus, ebi/emi, ethernet, i²c, mmc/sd/sdio, spi, uart/usart, usb otg. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as mcu, fpga. It has a long 44 weeks standard lead time. The product zynq®-7000, is a highly preferred choice for users. 225-cspbga (13x13) is the supplier device package value. single arm® cortex®-a9 mpcore™ with coresight™ is the product's core processor. It has a robust speed of 667mhz. Moreover, it corresponds to xc7z007, a base product number of the product. The product is designated with the 3a991d code number.

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Xilinx REACH211 Cert(Environmental Information)

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