Microchip Technology M2S060TS-1FGG676

M2S060TS-1FGG676 Microchip Technology
M2S060TS-1FGG676
Microchip Technology

Product Information

HTSUS:
8542.31.0070
RoHS Status:
ROHS3 Compliant
Number of I/O:
387
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
RAM Size:
64KB
Peripherals:
DDR, PCIe, SERDES
title:
M2S060TS-1FGG676
REACH Status:
REACH Unaffected
Connectivity:
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Manufacturer:
Microchip Technology
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
MCU, FPGA
standardLeadTime:
10 Weeks
Flash Size:
256KB
Series:
SmartFusion®2
Primary Attributes:
FPGA - 60K Logic Modules
Supplier Device Package:
676-FBGA (27x27)
Packaging:
Tray
Core Processor:
ARM® Cortex®-M3
Speed:
166MHz
Base Product Number:
M2S060
ECCN:
3A991D
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This is manufactured by Microchip Technology. The manufacturer part number is M2S060TS-1FGG676. It is assigned with possible HTSUS value of 8542.31.0070. The product is rohs3 compliant. 387 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 676-bga. The product has typical 64kb RAM size. It has supplied with other peripherals, such as ddr, pcie, serdes. In addition, it is reach unaffected. It provides connectivity solutions through canbus, ethernet, i2c, spi, uart/usart, usb. The microchip technology's product offers user-desired applications. Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as mcu, fpga. It has a long 10 weeks standard lead time. The product has 256kb flash size. The product smartfusion®2, is a highly preferred choice for users. Primary Attributes of the Product: fpga - 60k logic modules. 676-fbga (27x27) is the supplier device package value. In addition, tray is the available packaging type of the product. arm® cortex®-m3 is the product's core processor. It has a robust speed of 166mhz. Moreover, it corresponds to m2s060, a base product number of the product. The product is designated with the 3a991d code number.

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Software 19/Apr/2023(PCN Obsolescence/ EOL)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Manufacturing Change 30/Jun/2021(PCN Assembly/Origin)
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Mult Dev Updated Software 17/Jul/2024(PCN Design/Specification)
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Software 20/Apr/2023(PCN Design/Specification)
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WD_TIMEOUT 13/Aug/2019(PCN Other)

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