Microchip Technology A2F500M3G-FG484

A2F500M3G-FG484 Microchip Technology
Microchip Technology

Product Information

HTSUS:
8542.39.0001
RoHS Status:
RoHS non-compliant
Number of I/O:
MCU - 41, FPGA - 128
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
RAM Size:
64KB
Peripherals:
DMA, POR, WDT
Primary Attributes:
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
REACH Status:
REACH Unaffected
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
MCU, FPGA
standardLeadTime:
16 Weeks
Flash Size:
512KB
Series:
SmartFusion®
Supplier Device Package:
484-FPBGA (23x23)
Core Processor:
ARM® Cortex®-M3
Speed:
80MHz
Base Product Number:
A2F500
ECCN:
3A991D
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This is manufactured by Microchip Technology. The manufacturer part number is A2F500M3G-FG484. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs non-compliant. mcu - 41, fpga - 128 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 484-bga. The product has typical 64kb RAM size. It has supplied with other peripherals, such as dma, por, wdt. Primary Attributes of the Product: proasic®3 fpga, 500k gates, 11520 d-flip-flops. In addition, it is reach unaffected. It provides connectivity solutions through ebi/emi, ethernet, i2c, spi, uart/usart. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as mcu, fpga. It has a long 16 weeks standard lead time. The product has 512kb flash size. The product smartfusion®, is a highly preferred choice for users. 484-fpbga (23x23) is the supplier device package value. arm® cortex®-m3 is the product's core processor. It has a robust speed of 80mhz. Moreover, it corresponds to a2f500, a base product number of the product. The product is designated with the 3a991d code number.

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Software 19/Apr/2023(PCN Obsolescence/ EOL)
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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Manufacturing Change 23/Feb/2021(PCN Assembly/Origin)
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Software 19/Apr/2023(PCN Design/Specification)
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Software 20/Apr/2023(PCN Design/Specification)
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Logistics 16/Nov/2016(PCN Other)

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