Intel 5CSXFC4C6U23A7N

5CSXFC4C6U23A7N Intel
Intel

Product Information

HTSUS:
8542.39.0001
RoHS Status:
RoHS Compliant
Peripherals:
DMA, POR, WDT
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
672-FBGA
RAM Size:
64KB
Primary Attributes:
FPGA - 40K Logic Elements
REACH Status:
REACH Unaffected
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer:
Intel
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
MCU, FPGA
Qualification:
AEC-Q100
Number of I/O:
MCU - 181, FPGA - 145
standardLeadTime:
16 Weeks
Flash Size:
-
Grade:
Automotive
Series:
Cyclone® V SE
Supplier Device Package:
672-UBGA (23x23)
Packaging:
Tray
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed:
700MHz
ECCN:
3A991D
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This is manufactured by Intel. The manufacturer part number is 5CSXFC4C6U23A7N. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs compliant. It has supplied with other peripherals, such as dma, por, wdt. The product has -40°c ~ 125°c (tj) operating temperature range. Moreover, the product comes in 672-fbga. The product has typical 64kb RAM size. Primary Attributes of the Product: fpga - 40k logic elements. In addition, it is reach unaffected. It provides connectivity solutions through canbus, ebi/emi, ethernet, i2c, mmc/sd/sdio, spi, uart/usart, usb otg. The intel's product offers user-desired applications. Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as mcu, fpga. mcu - 181, fpga - 145 is the I/O value of the product. It has a long 16 weeks standard lead time. The product is automotive, a grade of class. The product cyclone® v se, is a highly preferred choice for users. 672-ubga (23x23) is the supplier device package value. In addition, tray is the available packaging type of the product. dual arm® cortex®-a9 mpcore™ with coresight™ is the product's core processor. It has a robust speed of 700mhz. The product is designated with the 3a991d code number.

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Alternate Assembly Site 07/Jun/2023(PCN Assembly/Origin)
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Mult PN LABEL 01/08/2023(PCN Design/Specification)
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Datasheet Update 09/Aug/2023(PCN Design/Specification)
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Automotive-Grade Device Handbook(Datasheets)
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Mult Dev Label Chgs 24/Feb/2020(PCN Packaging)
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Mult Dev Label Chgs 15/Apr/2024(PCN Packaging)

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