Microsemi Corporation A2F060M3E-1CSG288

Microsemi Corporation

Product Information

HTSUS:
8542.39.0001
Number of I/O:
MCU - 28, FPGA - 68
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
288-TFBGA, CSPBGA
RAM Size:
16KB
Peripherals:
DMA, POR, WDT
Primary Attributes:
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
REACH Status:
REACH Unaffected
Connectivity:
EBI/EMI, I²C, SPI, UART/USART
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
MCU, FPGA
Flash Size:
128KB
Series:
SmartFusion®
Supplier Device Package:
288-CSP (11x11)
Core Processor:
ARM® Cortex®-M3
Speed:
100MHz
Base Product Number:
A2F060M3E
ECCN:
3A991D
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This is manufactured by Microsemi Corporation. The manufacturer part number is A2F060M3E-1CSG288. It is assigned with possible HTSUS value of 8542.39.0001. mcu - 28, fpga - 68 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 288-tfbga, cspbga. The product has typical 16kb RAM size. It has supplied with other peripherals, such as dma, por, wdt. Primary Attributes of the Product: proasic®3 fpga, 60k gates, 1536d-flip-flops. In addition, it is reach unaffected. It provides connectivity solutions through ebi/emi, i²c, spi, uart/usart. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as mcu, fpga. The product has 128kb flash size. The product smartfusion®, is a highly preferred choice for users. 288-csp (11x11) is the supplier device package value. arm® cortex®-m3 is the product's core processor. It has a robust speed of 100mhz. Moreover, it corresponds to a2f060m3e, a base product number of the product. The product is designated with the 3a991d code number.

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Mult Dev Test Site 28/Feb/2019(PCN Assembly/Origin)
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Mult Dev Design Advisory 13/Oct/2017(PCN Design/Specification)
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A2FYYY 07/Nov/2016(PCN Design/Specification)
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Mult Devices 04/Apr/2017(PCN Obsolescence/ EOL)
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SmartFusion cSoC Datasheet(Datasheets)

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