Microsemi Corporation A2F060M3E-FGG256

A2F060M3E-FGG256 Microsemi Corporation
Microsemi Corporation

Product Information

HTSUS:
8542.31.0070
Number of I/O:
MCU - 26, FPGA - 66
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
RAM Size:
16KB
Peripherals:
DMA, POR, WDT
title:
A2F060M3E-FGG256
REACH Status:
REACH Unaffected
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Manufacturer:
Microsemi Corporation
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
MCU, FPGA
Flash Size:
128KB
Series:
SmartFusion®
Primary Attributes:
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Supplier Device Package:
256-FPBGA (17x17)
Packaging:
Tray
Core Processor:
ARM® Cortex®-M3
Speed:
80MHz
Base Product Number:
A2F060M3E
ECCN:
3A991D
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This is manufactured by Microsemi Corporation. The manufacturer part number is A2F060M3E-FGG256. It is assigned with possible HTSUS value of 8542.31.0070. mcu - 26, fpga - 66 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 256-lbga. The product has typical 16kb RAM size. It has supplied with other peripherals, such as dma, por, wdt. In addition, it is reach unaffected. It provides connectivity solutions through ebi/emi, i2c, spi, uart/usart. The microsemi corporation's product offers user-desired applications. Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as mcu, fpga. The product has 128kb flash size. The product smartfusion®, is a highly preferred choice for users. Primary Attributes of the Product: proasic®3 fpga, 60k gates, 1536d-flip-flops. 256-fpbga (17x17) is the supplier device package value. In addition, tray is the available packaging type of the product. arm® cortex®-m3 is the product's core processor. It has a robust speed of 80mhz. Moreover, it corresponds to a2f060m3e, a base product number of the product. The product is designated with the 3a991d code number.

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Mult Devices 04/Apr/2017(PCN Obsolescence/ EOL)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Mult Dev Test Site 28/Feb/2019(PCN Assembly/Origin)
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Mult Dev Design Advisory 13/Oct/2017(PCN Design/Specification)
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A2FYYY 07/Nov/2016(PCN Design/Specification)
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Logistics 16/Nov/2016(PCN Other)
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SmartFusion cSoC Datasheet(Datasheets)

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