Texas Instruments UCD90120ARGCT

UCD90120ARGCT Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.31.0075
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Supplier Device Package:
64-VQFN (9x9)
Operating Temperature:
-40°C ~ 110°C (TA)
Package / Case:
64-VFQFN Exposed Pad
Type:
Sequencer
title:
UCD90120ARGCT
REACH Status:
REACH Unaffected
edacadModel:
UCD90120ARGCT Models
Number of Voltages Monitored:
12
edacadModelUrl:
/en/models/2640491
Manufacturer:
Texas Instruments
Reset:
Active High/Active Low
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Output:
Open Drain, Push-Pull
standardLeadTime:
18 Weeks
Voltage - Threshold:
Adjustable/Selectable
Mounting Type:
Surface Mount
Series:
-
Reset Timeout:
2µs Minimum
Packaging:
Tape & Reel (TR)
Base Product Number:
UCD90120
ECCN:
3A991A2
Checking for live stock

This is manufactured by Texas Instruments. The manufacturer part number is UCD90120ARGCT. It is assigned with possible HTSUS value of 8542.31.0075. The product is rohs3 compliant. 64-vqfn (9x9) is the supplier device package value. The product has -40°c ~ 110°c (ta) operating temperature range. Moreover, the product comes in 64-vfqfn exposed pad. It comes in sequencer configuration. In addition, it is reach unaffected. The monitored voltages include 12. The texas instruments's product offers user-desired applications. It features reset options including active high/active low. Its typical moisture sensitivity level is 3 (168 hours). Moreover, the product allow the output of open drain, push-pull. It has a long 18 weeks standard lead time. The threshold voltage of the product is adjustable/selectable. The product is available in surface mount configuration. The product is supplied with a 2µs minimum reset timeout features. In addition, tape & reel (tr) is the available packaging type of the product. Moreover, it corresponds to ucd90120, a base product number of the product. The product is designated with the 3a991a2 code number.

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Wafer Fab Site Addition 15/Jun/2015(PCN Assembly/Origin)
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Copper Bond Wire Revision A 04/Dec/2013(PCN Design/Specification)
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Mult Dev Material Chg 29/Mar/2018(PCN Design/Specification)

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