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Hologram, Inc. GL1-MFF2-2500

Hologram, Inc.

Product Information

Carrier Network:
-
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-25°C ~ 85°C
Memory:
-
Format:
ESIM (MFF2)
Class:
-
Network Technology:
2G
Package:
Tape & Reel (TR)
Size / Dimension:
5mm L x 6mm W x 0.75mm H
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Features:
-
Series:
-
Core Processor:
-
Base Product Number:
SIM-E
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This is manufactured by Hologram, Inc.. The manufacturer part number is GL1-MFF2-2500. The product is rohs3 compliant. The product has -25°c ~ 85°c operating temperature range. It is available in esim (mff2) format. It utilise 2g network technology. It is shipped in tape & reel (tr) package . The product's diameters include 5mm l x 6mm w x 0.75mm h. Its typical moisture sensitivity level is 3 (168 hours). Moreover, it corresponds to sim-e, a base product number of the product.

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eUICC SIM(Datasheets)

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FAQs

Yes. You can also search GL1-MFF2-2500 on website for other similar products.
We accept all major payment methods for all products including ET23493241. Please check your shopping cart at the time of order.
You can order Hologram, Inc. brand products with GL1-MFF2-2500 directly through our website or call us at +44 (0) 3303 800 157 or email our support team at sales@enrgtech.co.uk.
Yes. Our products in Subscriber Identification Module (SIM) Cards category are shipped in lowest possible time.
You will get a confirmation email regarding your order of Hologram, Inc. GL1-MFF2-2500. You can also check on our website or by contacting our customer support team for further order details on Hologram, Inc. GL1-MFF2-2500.
We use our internationally recognized delivery partners UPS/DHL. Collection of ET23493241 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search "Hologram, Inc." products on our website by using Enrgtech's Unique Manufacturing Part Number ET23493241.
Yes. We ship GL1-MFF2-2500 Internationally to many countries around the world.
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