NXP USA Inc. BAV23C235

BAV23C235 NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8541.10.0070
Package / Case:
TO-236-3, SC-59, SOT-23-3
Diode Configuration:
1 Pair Common Cathode
Operating Temperature - Junction:
150°C (Max)
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
50 ns
Voltage - Forward (Vf) (Max) @ If:
1.25 V @ 200 mA
Package:
Bulk
Voltage - DC Reverse (Vr) (Max):
200 V
Current - Average Rectified (Io) (per Diode):
225mA (DC)
Current - Reverse Leakage @ Vr:
100 nA @ 200 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
TO-236AB
Technology:
Standard
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is BAV23C235. It is assigned with possible HTSUS value of 8541.10.0070. Moreover, the product comes in to-236-3, sc-59, sot-23-3. The diode features a 1 pair common cathode configuration. The product operate at temperatures ranging from 150°c (max). It has a robust speed of fast recovery =< 500ns, > 200ma (io). It has a trr (reverse recovery time) of 50 ns. The product has a maximum forward voltage of 1.25 v @ 200 ma. It is shipped in bulk package . While it has maximum reverse voltage of 200 v. The average rectified current at per diode is 225ma (dc). 100 na @ 200 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. to-236ab is the supplier device package value. This product use standard technology. The product is designated with the ear99 code number.

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