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The 70-4823-0910 from Kester Solder is a lead-free, no-clean solder paste featuring a Sn96.5Ag3Cu0.5 composition, packaged in a 17.64 oz (500g) jar. It provides superior soldering for electronics while minimising post-soldering cleanup.
Solder paste is a crucial component in electronics manufacturing, creating reliable and durable connections between electronic components. Kester Solder 70-4823-0910 is a lead-free, no-clean solder paste with excellent performance and reliability. It is a high-quality solder paste with excellent performance, reliability, and environmental compliance. Its lead-free composition, no-clean formula, and convenient packaging provide manufacturers with reliable and efficient soldering solutions for their electronic assemblies.
The Kester Solder 70-4823-0910 solder paste is formulated with Sn96.5Ag3Cu0.5 (96.5/3/0.5). This composition refers to the percentage of tin (Sn), silver (Ag), and copper (Cu) in the solder paste. The combination of these metals ensures a reliable and high-quality solder joint.
For more information please check the datasheets.
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