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TE Connectivity Solder Sleeve 2.15 → 5.08mm

ST63-3-55-22-90 TE Connectivity Solder Sleeve 2.15 → 5.08mm
ST63-3-55-22-90
ST63-3-55-22-90
ET16720911
ET16720911
Solder Sleeves
TE Connectivity

Product Information

Minimum Cable Diameter:
2.2mm
Series:
ST63
Material:
PVDF
Minimum Operating Temperature:
-55°C
Maximum Cable Diameter:
5mm
Sleeve Length:
16.5mm
Maximum Operating Temperature:
+150°C
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This is Solder Sleeve 2.15 → 5.08mm manufactured by TE Connectivity. The manufacturer part number is ST63-3-55-22-90. The minimum cable diameter is 2.2mm. The product st63, is a highly preferred choice for users. The product is made from highly stable and reliable pvdf. Whereas, the minimum operating temperature of the product is -55°c. While the maximum dimeter of the cable is 5mm. The sleeve has a 16.5mm length. It has a maximum operating temperature of +150°c.

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Datasheet(Technical Reference)

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FAQs

Yes. We ship ST63-3-55-22-90 Internationally to many countries around the world.
Yes. You can also search ST63-3-55-22-90 on website for other similar products.
We accept all major payment methods for all products including ET16720911. Please check your shopping cart at the time of order.
We use our internationally recognized delivery partners UPS/DHL. Collection of ET16720911 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search"TE Connectivity" products on our website by using Enrgtech's Unique Manufacturing Part Number ET16720911.
You can order TE Connectivity brand products with ST63-3-55-22-90 directly through our website or call us at +44 (0) 3303 800 157 or email our support team at sales@enrgtech.co.uk.
Yes. Our products in Solder Sleeves category are shipped in lowest possible time.
You will get a confirmation email regarding your order of TE Connectivity Solder Sleeve 2.15 → 5.08mm. You can also check on our website or by contacting our customer support team for further order details on TE Connectivity Solder Sleeve 2.15 → 5.08mm.
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