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Xilinx Inc. EF-DI-25G-TSN-802-1-CM-PROJ

Xilinx Inc.

Product Information

HTSUS:
0000.00.0000
RoHS Status:
RoHS non-compliant
License Length:
1 Year
Type:
License
Operating System:
-
Media Delivery Type:
-
License - User Details:
Project
Applications:
-
Package:
Bulk
Moisture Sensitivity Level (MSL):
Not Applicable
Series:
LogiCORE™
Edition:
-
For Use With/Related Products:
Xilinx
Base Product Number:
EF-DI
ECCN:
3D991
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This is manufactured by Xilinx Inc.. The manufacturer part number is EF-DI-25G-TSN-802-1-CM-PROJ. It is assigned with possible HTSUS value of 0000.00.0000. The product is rohs non-compliant. Licensed for: 1 year. It comes in license configuration. License Info - project. It is shipped in bulk package . Its typical moisture sensitivity level is not applicable. The product logicore™, is a highly preferred choice for users. The product is suitable for use with xilinx. Moreover, it corresponds to ef-di, a base product number of the product. The product is designated with the 3d991 code number.

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10G/25G High Speed Ethernet Subsystem v2.4 Guide(Datasheets)
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Xiliinx RoHS3 Cert(Environmental Information)
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Xilinx REACH211 Cert(Environmental Information)

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FAQs

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You can order Xilinx Inc. brand products with EF-DI-25G-TSN-802-1-CM-PROJ directly through our website or call us at +44 (0) 3303 800 157 or email our support team at sales@enrgtech.co.uk.
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You will get a confirmation email regarding your order of Xilinx Inc. EF-DI-25G-TSN-802-1-CM-PROJ. You can also check on our website or by contacting our customer support team for further order details on Xilinx Inc. EF-DI-25G-TSN-802-1-CM-PROJ.
We use our internationally recognized delivery partners UPS/DHL. Collection of ET18187959 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search "Xilinx Inc." products on our website by using Enrgtech's Unique Manufacturing Part Number ET18187959.
Yes. We ship EF-DI-25G-TSN-802-1-CM-PROJ Internationally to many countries around the world.
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