Row Width:
10.16mm
Number of Contacts:
28
Current Rating:
1A
Dimensions:
40.5 x 27.9 x 6.9mm
Mounting Type:
Through Hole
Series:
2281290
Termination Method:
Solder
Length:
40.5mm
Housing Material:
Glass Filled Polysulfone
Width:
27.9mm
Depth:
6.9mm
Contact Plating:
Gold over Nickel
Pitch:
1.78mm
Orientation:
Straight
Contact Material:
Beryllium Copper
Maximum Operating Temperature:
+125°C
Minimum Operating Temperature:
-55°C
Frame Type:
Closed Frame
HTSUS:
8536.69.4040
RoHS Status:
RoHS Compliant
Convert From (Adapter End):
DIP, 0.4" (10.16mm) Row Spacing
Housing Material:
Polysulfone (PSU), Glass Filled
Operating Temperature:
-55°C ~ 125°C
Contact Finish Thickness - Post:
30.0µin (0.76µm)
Contact Material - Mating:
Beryllium Copper
Contact Finish - Mating:
Gold
Convert To (Adapter End):
DIP, 0.4" (10.16mm) Row Spacing
Number of Pins:
28
Material Flammability Rating:
UL94 V-0
Contact Material - Post:
Beryllium Copper
Package:
Box
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Termination:
Solder
Current Rating (Amps):
1 A
Pitch - Mating:
0.070" (1.78mm)
Features:
-
Mounting Type:
Through Hole
Termination Post Length:
0.130" (3.30mm)
Series:
Textool™
ECCN:
EAR99
Contact Finish Thickness - Mating:
30.0µin (0.76µm)
Pitch - Post:
0.070" (1.78mm)
Board Material:
-
Base Product Number:
228
Contact Finish - Post:
Gold
