Dimensions:
6.73 x 6.22 x 2.39mm
Maximum Continuous Drain Current:
16 A
Transistor Material:
Si
Width:
6.22mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
25 V
Maximum Drain Source Resistance:
19.2 mΩ
Package Type:
TO-252
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
1V
Maximum Operating Temperature:
+175 °C
Typical Gate Charge @ Vgs:
17 nC @ 10 V
Channel Type:
N
Typical Input Capacitance @ Vds:
927 pF @ 13 V
Length:
6.73mm
Pin Count:
3
Typical Turn-Off Delay Time:
16 ns
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
32.6 W
Series:
PowerTrench
Maximum Gate Source Voltage:
-20 V, +20 V
Height:
2.39mm
Typical Turn-On Delay Time:
7 ns
Minimum Operating Temperature:
-55 °C
FET Feature:
-
HTSUS:
0000.00.0000
Vgs(th) (Max) @ Id:
3V @ 250µA
Operating Temperature:
-55°C ~ 175°C (TJ)
Package / Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Rds On (Max) @ Id, Vgs:
8.6mOhm @ 16.4A, 10V
Gate Charge (Qg) (Max) @ Vgs:
24 nC @ 10 V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Unaffected
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Package:
Bulk
Drain to Source Voltage (Vdss):
25 V
Vgs (Max):
±20V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Power Dissipation (Max):
3.7W (Ta), 32.6W (Tc)
Input Capacitance (Ciss) (Max) @ Vds:
1235 pF @ 13 V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
TO-252 (DPAK)
Current - Continuous Drain (Id) @ 25°C:
16.4A (Ta), 30A (Tc)
Technology:
MOSFET (Metal Oxide)
Base Product Number:
FDD678
ECCN:
EAR99
