Vishay General Semiconductor - Diodes Division VS-EPU3006HN3

VS-EPU3006HN3 Vishay General Semiconductor - Diodes Division
VS-EPU3006HN3
Vishay General Semiconductor - Diodes Division

Product Information

HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-247-2
Reverse Recovery Time (trr):
45 ns
Operating Temperature - Junction:
-65°C ~ 175°C
REACH Status:
REACH Unaffected
Current - Average Rectified (Io):
30A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
2 V @ 30 A
Package:
Tube
Voltage - DC Reverse (Vr) (Max):
600 V
Capacitance @ Vr, F:
-
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
11 Weeks
Current - Reverse Leakage @ Vr:
30 µA @ 600 V
Mounting Type:
Through Hole
Series:
FRED Pt®
Supplier Device Package:
TO-247AC Modified
Technology:
Standard
Base Product Number:
EPU3006
ECCN:
EAR99
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This is manufactured by Vishay General Semiconductor - Diodes Division. The manufacturer part number is VS-EPU3006HN3. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in to-247-2. It has a trr (reverse recovery time) of 45 ns. The product operate at temperatures ranging from -65°c ~ 175°c. In addition, it is reach unaffected. It features a 30a of average rectified current. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 2 v @ 30 a. It is shipped in tube package . While it has maximum reverse voltage of 600 v. Its typical moisture sensitivity level is 1 (unlimited). It has a long 11 weeks standard lead time. 30 µa @ 600 v is the reverse leakage value of a bespoke product. The product is available in through hole configuration. The product fred pt®, is a highly preferred choice for users. to-247ac modified is the supplier device package value. This product use standard technology. Moreover, it corresponds to epu3006, a base product number of the product. The product is designated with the ear99 code number.

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VS-(A,E)PU3006HN3(Datasheets)
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Mult Dev Mold Chg 13/Sep/2019(PCN Design/Specification)

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