Vishay General Semiconductor - Diodes Division BYG23M-E3/TR3

BYG23M-E3-TR3 Vishay General Semiconductor - Diodes Division BYG23M-E3/TR3
Vishay General Semiconductor - Diodes Division

Product Information

Reverse Recovery Time (trr):
75 ns
HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
DO-214AC, SMA
edacadModel:
BYG23M-E3/TR3 Models
Operating Temperature - Junction:
-55°C ~ 150°C
REACH Status:
REACH Unaffected
edacadModelUrl:
/en/models/2143497
Current - Average Rectified (Io):
1.5A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
1.7 V @ 1 A
Package:
Tape & Reel (TR)
Voltage - DC Reverse (Vr) (Max):
1000 V
Capacitance @ Vr, F:
-
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
10 Weeks
Current - Reverse Leakage @ Vr:
5 µA @ 1000 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
DO-214AC (SMA)
Technology:
Avalanche
Base Product Number:
BYG23
ECCN:
EAR99
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This is manufactured by Vishay General Semiconductor - Diodes Division. The manufacturer part number is BYG23M-E3/TR3. It has a trr (reverse recovery time) of 75 ns. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in do-214ac, sma. The product operate at temperatures ranging from -55°c ~ 150°c. In addition, it is reach unaffected. It features a 1.5a of average rectified current. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 1.7 v @ 1 a. It is shipped in tape & reel (tr) package . While it has maximum reverse voltage of 1000 v. Its typical moisture sensitivity level is 1 (unlimited). It has a long 10 weeks standard lead time. 5 µa @ 1000 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. do-214ac (sma) is the supplier device package value. This product use avalanche technology. Moreover, it corresponds to byg23, a base product number of the product. The product is designated with the ear99 code number.

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Additional In-House Backend Assembly Site 09/Nov/2023(PCN Assembly/Origin)
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Packaging Information(Datasheets)
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BYG23M(Datasheets)

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