Microchip Technology MSC030SDA070S

MSC030SDA070S Microchip Technology
MSC030SDA070S
Microchip Technology

Product Information

HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Operating Temperature - Junction:
-55°C ~ 175°C
REACH Status:
REACH Unaffected
Reverse Recovery Time (trr):
0 ns
Current - Average Rectified (Io):
60A
Speed:
No Recovery Time > 500mA (Io)
Voltage - Forward (Vf) (Max) @ If:
1.8 V @ 30 A
Voltage - DC Reverse (Vr) (Max):
700 V
Capacitance @ Vr, F:
-
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
11 Weeks
Current - Reverse Leakage @ Vr:
200 µA @ 700 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
D3PAK
Packaging:
Tube
Technology:
SiC (Silicon Carbide) Schottky
Base Product Number:
MSC030
ECCN:
EAR99
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This is manufactured by Microchip Technology. The manufacturer part number is MSC030SDA070S. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in to-268-3, d3pak (2 leads + tab), to-268aa. The product operate at temperatures ranging from -55°c ~ 175°c. In addition, it is reach unaffected. It has a trr (reverse recovery time) of 0 ns. It features a 60a of average rectified current. It has a robust speed of no recovery time > 500ma (io). The product has a maximum forward voltage of 1.8 v @ 30 a. While it has maximum reverse voltage of 700 v. Its typical moisture sensitivity level is 1 (unlimited). It has a long 11 weeks standard lead time. 200 µa @ 700 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. d3pak is the supplier device package value. In addition, tube is the available packaging type of the product. This product use sic (silicon carbide) schottky technology. Moreover, it corresponds to msc030, a base product number of the product. The product is designated with the ear99 code number.

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Mult Dev Mold Compound 24/May/2024(PCN Assembly/Origin)
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Top Marking Changes 22/Feb/2023(PCN Design/Specification)
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Label Change 03/Jan/2023(PCN Packaging)

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