Texas Instruments DS90LV001TMX/NOPB

DS90LV001TMX-NOPB Texas Instruments DS90LV001TMX/NOPB
Texas Instruments

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 85°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Input:
CML, LVDS, LVPECL
Type:
Buffer, ReDriver
Signal Conditioning:
-
REACH Status:
REACH Unaffected
edacadModel:
DS90LV001TMX/NOPB Models
Applications:
LVDS
Current - Supply:
47mA
Number of Channels:
1
edacadModelUrl:
/en/models/1870849
Manufacturer:
Texas Instruments
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Output:
LVDS
standardLeadTime:
6 Weeks
Delay Time:
1.4ns
Data Rate (Max):
800Mbps
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Packaging:
Tape & Reel (TR)
Voltage - Supply:
3V ~ 3.6V
Base Product Number:
DS90LV001
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is DS90LV001TMX/NOPB. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). Its input values include cml, lvds, lvpecl. It comes in buffer, redriver configuration. In addition, it is reach unaffected. The product is widely employed in lvds. The current - supply of a bespoke product is 47ma. It is supplied with 1 channels. The texas instruments's product offers user-desired applications. Its typical moisture sensitivity level is 1 (unlimited). Moreover, the product allow the output of lvds. It has a long 6 weeks standard lead time. A product has a 1.4ns delay time. Robust and maximum data rate speed of 800mbps. The product is available in surface mount configuration. 8-soic is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. It has optimum voltage supply of 3v ~ 3.6v. Moreover, it corresponds to ds90lv001, a base product number of the product. The product is designated with the ear99 code number.

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Mold Compound 24/Mar/2016(PCN Design/Specification)
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SOIC Pkg Wire Bonding 20/Mar/2013(PCN Design/Specification)

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