Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39871B3568U410W9

B39871B3568U410W9 Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)

Product Information

Size / Dimension:
0.118" L x 0.118" W (3.00mm x 3.00mm)
Frequency - Center:
869MHz
Mounting Type:
Surface Mount
Height (Max):
0.043" (1.10mm)
Standard Package:
9,000
Packaging:
Bulk
Applications:
Remote Control
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Package / Case:
6-SMD, No Lead
Insertion Loss:
4dB
Manufacturer:
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
RoHs Compliant
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This is manufactured by Qualcomm (RF360 - A Qualcomm & TDK Joint Venture). The manufacturer part number is B39871B3568U410W9. The product's diameters include 0.118" l x 0.118" w (3.00mm x 3.00mm). It features center frequency of 869mhz. The product is available in surface mount configuration. Additionally, the 0.043" (1.10mm) is the maximum height of the product. It is available in the standard package of 9,000. In addition, bulk is the available packaging type of the product. The product is widely employed in remote control. Its typical moisture sensitivity level is 1 (unlimited). Moreover, the product comes in 6-smd, no lead. Allows 4db of insertion loss. The qualcomm (rf360 - a qualcomm & tdk joint venture)'s product offers user-desired applications.

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B39871B3568U410(Datasheets)

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