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United Kingdom
This is manufactured by Laird Technologies EMI. The manufacturer part number is 67SLG060080070PI00. It has typical 4 weeks of manufacturer standard lead time. It employs the solder method for attachment. The product smd grounding metallized, is a highly preferred choice for users. The product is made from highly stable and reliable polyurethane foam, tin-copper polyester (sn/cu). Its accurate length is 0.276" (7.00mm). In addition, the height is 0.315" (8.00mm). In addition, cut tape (ct) is the available packaging type of the product. Furthermore, the product is 0.236" (6.00mm) wide. It is a rectangle product with unique specifications. The product has -40°c ~ 70°c operating temperature range. It comes in film over foam configuration. The laird technologies emi's product offers user-desired applications.
For more information please check the datasheets.
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