Infineon Technologies BCM20702B0KWFBGT

BCM20702B0KWFBGT Infineon Technologies
Infineon Technologies

Product Information

HTSUS:
0000.00.0000
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Supplier Device Package:
50-WFBGA (4.5x4)
Operating Temperature:
-30°C ~ 85°C
Memory Size:
-
Package / Case:
50-WFBGA
GPIO:
7
Type:
TxRx + MCU
Current - Transmitting:
65mA
Current - Receiving:
32mA
Modulation:
4DQPSK, 8DPSK, GFSK
REACH Status:
REACH Unaffected
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
3 (168 Hours)
RF Family/Standard:
Bluetooth
Data Rate (Max):
3Mbps
Protocol:
Bluetooth v4.0 +EDR
Mounting Type:
Surface Mount
Series:
-
Sensitivity:
-92dBm
Serial Interfaces:
I2C, I2S, SPI, UART, USB
Frequency:
2.4GHz
Voltage - Supply:
2.3V ~ 5.5V
Power - Output:
10dBm
Base Product Number:
BCM20702
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This is manufactured by Infineon Technologies. The manufacturer part number is BCM20702B0KWFBGT. It is assigned with possible HTSUS value of 0000.00.0000. The product is rohs3 compliant. 50-wfbga (4.5x4) is the supplier device package value. The product has -30°c ~ 85°c operating temperature range. Moreover, the product comes in 50-wfbga. It consists of 7 GPIO. It comes in txrx + mcu configuration. It carries 65ma transmission current. The current receiving of the product is 32ma. Features 4dqpsk, 8dpsk, gfsk modulation. In addition, it is reach unaffected. It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 3 (168 hours). The standard RF Family of the product includes bluetooth. Robust and maximum data rate speed of 3mbps. The product features a bluetooth v4.0 +edr protocol. The product is available in surface mount configuration. The sensitivity given includes -92dbm. It features i2c, i2s, spi, uart, usb serial interface. Supplied with 2.4ghz of frequency. It has optimum voltage supply of 2.3v ~ 5.5v. The product has an output power 10dbm. Moreover, it corresponds to bcm20702, a base product number of the product.

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Mult Dev Assembly Add 18/Mar/2019(PCN Assembly/Origin)
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Mult Dev Vulnerability Issue 6/Mar/2019(PCN Design/Specification)
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BCM43143KMLG Mark/PN Chg 19/Dec/2016(PCN Part Status Change)
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Ship Label REV(PCN Packaging)
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Mult Dev Cover Tape Chg 26/Sep/2019(PCN Packaging)

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FAQs

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