Cypress Semiconductor Corp CYRF89435-40LTXC

CYRF89435-40LTXC Cypress Semiconductor Corp
Cypress Semiconductor Corp

Product Information

Detailed Description:
IC RF TxRx + MCU General ISM > 1GHZ 2.4GHz 40-VFQFN Exposed Pad
Supplier Device Package:
40-QFN (6x6)
Operating Temperature:
0°C ~ 70°C
Memory Size:
32kB Flash, 2kB SRAM
Package / Case:
40-VFQFN Exposed Pad
GPIO:
13
Type:
TxRx + MCU
Current - Transmitting:
13.7mA ~ 18.5mA
Current - Receiving:
18mA
Modulation:
FHSS, GFSK
Manufacturer:
Cypress Semiconductor Corp
RF Family/Standard:
General ISM > 1GHZ
Data Rate (Max):
1Mbps
Mounting Type:
Surface Mount
Series:
PRoC®
Sensitivity:
-87dBm
Serial Interfaces:
I²C, SPI
Packaging:
Tray
Frequency:
2.4GHz
Voltage - Supply:
1.9V ~ 3.6V
Customer Reference:
Power - Output:
1dBm
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This is manufactured by Cypress Semiconductor Corp. The manufacturer part number is CYRF89435-40LTXC. It features ic rf txrx + mcu general ism > 1ghz 2.4ghz 40-vfqfn exposed pad. 40-qfn (6x6) is the supplier device package value. The product has 0°c ~ 70°c operating temperature range. It holds a typical memory size of 32kb flash, 2kb sram. Moreover, the product comes in 40-vfqfn exposed pad. It consists of 13 GPIO. It comes in txrx + mcu configuration. It carries 13.7ma ~ 18.5ma transmission current. The current receiving of the product is 18ma. Features fhss, gfsk modulation. The cypress semiconductor corp's product offers user-desired applications. The standard RF Family of the product includes general ism > 1ghz. Robust and maximum data rate speed of 1mbps. The product is available in surface mount configuration. The product proc®, is a highly preferred choice for users. The sensitivity given includes -87dbm. It features i²c, spi serial interface. In addition, tray is the available packaging type of the product. Supplied with 2.4ghz of frequency. It has optimum voltage supply of 1.9v ~ 3.6v. The product has an output power 1dbm.

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GSMC Manufacture Merger 15/May/2014(PCN Assembly/Origin)
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Tin Lead Frame Update 24/Dec/2014(PCN Design/Specification)
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Mult Dev EOL 15/Dec/2017(PCN Obsolescence/ EOL)
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Ship Label/Document Standardization 24/Jan/2018(PCN Packaging)
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Ship Label Changes 28/Feb/2021(PCN Packaging)

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