Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39921R973H110

Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)

Product Information

Size / Dimension:
0.118" L x 0.118" W (3.00mm x 3.00mm)
Detailed Description:
SAW Resonator Surface Mount
Mounting Type:
Surface Mount
Height:
0.039" (1.00mm)
Packaging:
Tape & Reel (TR)
Customer Reference:
Package / Case:
6-SMD, No Lead
Type:
SAW
Manufacturer:
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
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This is manufactured by Qualcomm (RF360 - A Qualcomm & TDK Joint Venture). The manufacturer part number is B39921R973H110. The product's diameters include 0.118" l x 0.118" w (3.00mm x 3.00mm). It features saw resonator surface mount. The product is available in surface mount configuration. In addition, the height is 0.039" (1.00mm). In addition, tape & reel (tr) is the available packaging type of the product. Moreover, the product comes in 6-smd, no lead. It comes in saw configuration. The qualcomm (rf360 - a qualcomm & tdk joint venture)'s product offers user-desired applications.

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FAQs

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Yes. Our products in Resonators category are shipped in lowest possible time.
You will get a confirmation email regarding your order of Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39921R973H110. You can also check on our website or by contacting our customer support team for further order details on Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39921R973H110.
We use our internationally recognized delivery partners UPS/DHL. Collection of ET15758925 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search "Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)" products on our website by using Enrgtech's Unique Manufacturing Part Number ET15758925.
Yes. We ship B39921R973H110 Internationally to many countries around the world.