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United Kingdom
This is manufactured by Qualcomm (RF360 - A Qualcomm & TDK Joint Venture). The manufacturer part number is B39921R973H110. The product's diameters include 0.118" l x 0.118" w (3.00mm x 3.00mm). It features saw resonator surface mount. The product is available in surface mount configuration. In addition, the height is 0.039" (1.00mm). In addition, tape & reel (tr) is the available packaging type of the product. Moreover, the product comes in 6-smd, no lead. It comes in saw configuration. The qualcomm (rf360 - a qualcomm & tdk joint venture)'s product offers user-desired applications.
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