Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39391R972H110

Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)

Product Information

Size / Dimension:
0.118" L x 0.118" W (3.00mm x 3.00mm)
Frequency Stability:
±50ppm
Mounting Type:
Surface Mount
Series:
R972
Standard Package:
9,000
Height:
0.039" (1.00mm)
Packaging:
Tape & Reel (TR)
Operating Temperature:
-40°C ~ 125°C
Frequency:
390MHz
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Package / Case:
6-SMD
Impedance:
50 Ohm
Type:
SAW
Manufacturer:
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
RoHs Compliant
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This is manufactured by Qualcomm (RF360 - A Qualcomm & TDK Joint Venture). The manufacturer part number is B39391R972H110. The product's diameters include 0.118" l x 0.118" w (3.00mm x 3.00mm). It also carries ±50ppm of stable frequency value. The product is available in surface mount configuration. The product r972, is a highly preferred choice for users. It is available in the standard package of 9,000. In addition, the height is 0.039" (1.00mm). In addition, tape & reel (tr) is the available packaging type of the product. The product has -40°c ~ 125°c operating temperature range. Supplied with 390mhz of frequency. Its typical moisture sensitivity level is 1 (unlimited). Moreover, the product comes in 6-smd. It has an impedance value of 50 ohm. It comes in saw configuration. The qualcomm (rf360 - a qualcomm & tdk joint venture)'s product offers user-desired applications.

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B39391-R972-H110(Datasheets)

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