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NXP USA Inc. MFS2324BMBA0EPR2

NXP USA Inc.

Product Information

Mounting Type:
Surface Mount, Wettable Flank
title:
MFS2324BMBA0EPR2
Grade:
-
Series:
-
REACH Status:
REACH Unaffected
Supplier Device Package:
48-HVQFN (7x7)
Packaging:
Bulk
Applications:
System Basis Chip
Operating Temperature:
-40°C ~ 120°C
Current - Supply:
-
Voltage - Supply:
3.3V, 5V
Qualification:
-
Package / Case:
48-VFQFN Exposed Pad
standardLeadTime:
30 Weeks
Manufacturer:
NXP USA Inc.
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This is manufactured by NXP USA Inc.. The manufacturer part number is MFS2324BMBA0EPR2. The product is available in surface mount, wettable flank configuration. In addition, it is reach unaffected. 48-hvqfn (7x7) is the supplier device package value. In addition, bulk is the available packaging type of the product. The product is widely employed in system basis chip. The product has -40°c ~ 120°c operating temperature range. It has optimum voltage supply of 3.3v, 5v. Moreover, the product comes in 48-vfqfn exposed pad. It has a long 30 weeks standard lead time. The nxp usa inc.'s product offers user-desired applications.

pdf icon
FS23_SBC(Product Brief)
pdf icon
Mult Dev Datasheet 11/Jul/2024(PCN Design/Specification)

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