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NXP USA Inc. MFS2323BMBA5EPR2

MFS2323BMBA5EPR2 NXP USA Inc.
NXP USA Inc.

Product Information

Mounting Type:
Surface Mount, Wettable Flank
HTSUS:
8542.39.0001
Series:
-
Supplier Device Package:
48-HVQFN (7x7)
Packaging:
Tape & Reel (TR)
Applications:
System Basis Chip
Operating Temperature:
-40°C ~ 125°C (TA)
Current - Supply:
30µA
Voltage - Supply:
5.5V ~ 40V
Package / Case:
48-VFQFN Exposed Pad
standardLeadTime:
30 Weeks
Manufacturer:
NXP USA Inc.
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is MFS2323BMBA5EPR2. The product is available in surface mount, wettable flank configuration. It is assigned with possible HTSUS value of 8542.39.0001. 48-hvqfn (7x7) is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. The product is widely employed in system basis chip. The product has -40°c ~ 125°c (ta) operating temperature range. The current - supply of a bespoke product is 30µa. It has optimum voltage supply of 5.5v ~ 40v. Moreover, the product comes in 48-vfqfn exposed pad. It has a long 30 weeks standard lead time. The nxp usa inc.'s product offers user-desired applications. The product is designated with the ear99 code number.

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FS23_SBC(Product Brief)

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