NXP USA Inc. MFS2303BMBA3EP

MFS2303BMBA3EP NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 125°C (TA)
Package / Case:
48-VFQFN Exposed Pad
REACH Status:
REACH Unaffected
Applications:
System Basis Chip
Current - Supply:
40µA
Manufacturer:
NXP USA Inc.
Moisture Sensitivity Level (MSL):
3 (168 Hours)
standardLeadTime:
30 Weeks
Mounting Type:
Surface Mount, Wettable Flank
Series:
-
Supplier Device Package:
48-HVQFN (7x7)
Packaging:
Tray
Voltage - Supply:
5.5V ~ 40V
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is MFS2303BMBA3EP. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The product has -40°c ~ 125°c (ta) operating temperature range. Moreover, the product comes in 48-vfqfn exposed pad. In addition, it is reach unaffected. The product is widely employed in system basis chip. The current - supply of a bespoke product is 40µa. The nxp usa inc.'s product offers user-desired applications. Its typical moisture sensitivity level is 3 (168 hours). It has a long 30 weeks standard lead time. The product is available in surface mount, wettable flank configuration. 48-hvqfn (7x7) is the supplier device package value. In addition, tray is the available packaging type of the product. It has optimum voltage supply of 5.5v ~ 40v. The product is designated with the ear99 code number.

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FS23_SBC(Product Brief)

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