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Casting Compound, Epoxy Resin ER 2074, ER 2183 Casting compound for encapsulating electronic assemblies Vibration isolation and prevention of stress exposure ER 2074 RS stock no. 160-8469 — very high thermal transfer properties (thermal conductivity of 1.26W/mK) Entirely free of grinding fillers Low heat emission upon hardening At a storage or transport temperature below 10 °C, the product may contain small clots as a result of crystallisation, which impedes its use with dispensing systems. Upon heating to max. 50 °C, crystals dissolve again ER 2183 RS stock no. 337-5919 — high thermal transfer properties, oil-resistant ER 2074 ER 2183 Colour: White Black Density (g/cm³): 2.2 2.2 Viscosity (mm²/s): 1670 500 Drop time (min): 90 120 Final strength (h): 24 24 Shore hardness: D88 D90 Dielectric strength (kV/mm): 10 10 Thermal conductivity (W/mK): 1.26 1.10 Temperature range (°C): -40 → +130 -40 → +130 Mix ratio: 17.3:1 12.8:1 Potting Compounds: Twin Packs The twin pack format enables 'mixing in the bag' of resin and hardener, preventing air entrapment and permitting ease of application without the need for direct operator contact, thereby reducing handling risk and mess. Each twin pack is supplied with full instructions for use. All packs are supplied with a desiccant for storage.
For more information please check the datasheets.
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