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The t-Global Technology TG-A6200-100-100-0.5 is a high-performance thermal interface material designed to bridge the gap between heat-producing devices and heatsinks or other cooling devices. This silicone-based thermal pad is engineered for superior thermal conductivity, ensuring efficient heat transfer in demanding applications. Its soft, compressible nature allows it to conform easily to uneven surfaces, providing excellent contact and reducing thermal resistance. It is ideal for use in electronic devices where consistent performance and reliability are paramount.
For more information please check the datasheets.
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