ON Semiconductor H11L3VM

H11L3VM ON Semiconductor
ON Semiconductor

Product Information

Manufacturer Standard Lead Time:
10 Weeks
Detailed Description:
Logic Output Optoisolator 1MHz Open Collector 4170Vrms 1 Channel CMTI 6-DIP
Propagation Delay tpLH / tpHL (Max):
4µs, 4µs
Operating Temperature:
-40°C ~ 85°C
Input Type:
DC
Package / Case:
6-DIP (0.300", 7.62mm)
Base Part Number:
H11L
Rise / Fall Time (Typ):
100ns, 100ns
Output Type:
Open Collector
Current - DC Forward (If) (Max):
30mA
Number of Channels:
1
Data Rate:
1MHz
Manufacturer:
ON Semiconductor
Current - Output / Channel:
50mA
Inputs - Side 1/Side 2:
1/0
Voltage - Forward (Vf) (Typ):
1.2V
Voltage - Isolation:
4170Vrms
Mounting Type:
Through Hole
Supplier Device Package:
6-DIP
Packaging:
Tube
Voltage - Supply:
3V ~ 15V
Customer Reference:
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is H11L3VM. It has typical 10 weeks of manufacturer standard lead time. It features logic output optoisolator 1mhz open collector 4170vrms 1 channel cmti 6-dip. It has a maximum propagation delay of 4µs, 4µs. The product has -40°c ~ 85°c operating temperature range. It carries dc input type. Moreover, the product comes in 6-dip (0.300", 7.62mm). Base Part Number: h11l. The typical rise and fall time of the product is 100ns, 100ns. Furthermore, it has aopen collector output. The maximum DC forward current of the product is 30ma. It is supplied with 1 channels. It has a maximised data speed rate of 1mhz. The on semiconductor's product offers user-desired applications. It carries 50ma output or channel current. The typical 1/0 inputs of both sides (side 1/side 2). The typical forward voltage (Vf) of the product is 1.2v. 4170vrms of isolation voltage. The product is available in through hole configuration. 6-dip is the supplier device package value. In addition, tube is the available packaging type of the product. It has optimum voltage supply of 3v ~ 15v.

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Logo 17/Aug/2017(PCN Design/Specification)
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Datasheet Update 11/Jun/2014(PCN Design/Specification)
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Mult Devices 24/Oct/2017(PCN Packaging)

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