Broadcom Limited HCPL-2200#060

HCPL-2200-060 Broadcom Limited HCPL-2200#060
Broadcom Limited

Product Information

HTSUS:
8541.49.8000
RoHS Status:
RoHS non-compliant
Current - Output / Channel:
25 mA
Propagation Delay tpLH / tpHL (Max):
300ns, 300ns
Operating Temperature:
-40°C ~ 85°C
Input Type:
DC
Package / Case:
8-DIP (0.300", 7.62mm)
Current - DC Forward (If) (Max):
10mA
Rise / Fall Time (Typ):
55ns, 15ns
REACH Status:
REACH Unaffected
Output Type:
Tri-State
Number of Channels:
1
Data Rate:
2.5MBd
Inputs - Side 1/Side 2:
1/0
Package:
Tube
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Common Mode Transient Immunity (Min):
1kV/µs
Voltage - Forward (Vf) (Typ):
1.5V
Voltage - Isolation:
3750Vrms
Mounting Type:
Through Hole
Series:
-
Supplier Device Package:
8-DIP
Voltage - Supply:
4.5V ~ 20V
ECCN:
EAR99
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This is manufactured by Broadcom Limited. The manufacturer part number is HCPL-2200#060. It is assigned with possible HTSUS value of 8541.49.8000. The product is rohs non-compliant. It carries 25 ma output or channel current. It has a maximum propagation delay of 300ns, 300ns. The product has -40°c ~ 85°c operating temperature range. It carries dc input type. Moreover, the product comes in 8-dip (0.300", 7.62mm). The maximum DC forward current of the product is 10ma. The typical rise and fall time of the product is 55ns, 15ns. In addition, it is reach unaffected. Furthermore, it has atri-state output. It is supplied with 1 channels. It has a maximised data speed rate of 2.5mbd. The typical 1/0 inputs of both sides (side 1/side 2). It is shipped in tube package . Its typical moisture sensitivity level is 1 (unlimited). Allows a 1kv/µs of minimum common mode transient immunity. The typical forward voltage (Vf) of the product is 1.5v. 3750vrms of isolation voltage. The product is available in through hole configuration. 8-dip is the supplier device package value. It has optimum voltage supply of 4.5v ~ 20v. The product is designated with the ear99 code number.

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Molding Chg 08/Feb/2016(PCN Design/Specification)
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Mult Device Design Changes 10/Nov/2015(PCN Design/Specification)
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Multiple Devices Marking/Labeling 07/Aug/2013(PCN Packaging)
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Marking/Labeling Revision B 14/Jan/2014(PCN Packaging)

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FAQs

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