P-Channel MOSFET, 33 A, 100 V, 3-Pin D2PAK onsemi FQB34P10TM

FQB34P10TM P-Channel MOSFET, 33 A, 100 V, 3-Pin D2PAK onsemi
FQB34P10TM
FQB34P10TM
onsemi

Product Information

Maximum Drain Source Voltage:
100 V
Typical Gate Charge @ Vgs:
85 nC @ 10 V
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
3.75 W
Maximum Gate Source Voltage:
-25 V, +25 V
Height:
4.83mm
Width:
9.65mm
Length:
10.67mm
Minimum Gate Threshold Voltage:
2V
Package Type:
D2PAK (TO-263)
Number of Elements per Chip:
1
Minimum Operating Temperature:
-55 °C
Maximum Continuous Drain Current:
33 A
Transistor Material:
Si
Maximum Drain Source Resistance:
60 mΩ
Channel Type:
P
Maximum Operating Temperature:
+175 °C
Pin Count:
3
Transistor Configuration:
Single
FET Feature:
-
HTSUS:
8541.29.0095
Vgs(th) (Max) @ Id:
4V @ 250µA
Operating Temperature:
-55°C ~ 175°C (TJ)
Package / Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Rds On (Max) @ Id, Vgs:
60mOhm @ 16.75A, 10V
edacadModel:
FQB34P10TM Models
Gate Charge (Qg) (Max) @ Vgs:
110 nC @ 10 V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Unaffected
FET Type:
P-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
edacadModelUrl:
/en/models/1056839
Package:
Tape & Reel (TR)
Drain to Source Voltage (Vdss):
100 V
Vgs (Max):
±25V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Power Dissipation (Max):
3.75W (Ta), 155W (Tc)
Input Capacitance (Ciss) (Max) @ Vds:
2910 pF @ 25 V
Mounting Type:
Surface Mount
Series:
QFET®
Supplier Device Package:
TO-263 (D2PAK)
Current - Continuous Drain (Id) @ 25°C:
33.5A (Tc)
Technology:
MOSFET (Metal Oxide)
Base Product Number:
FQB34P10
ECCN:
EAR99
RoHs Compliant
Checking for live stock

This is P-Channel MOSFET 33 A 100 V 3-Pin D2PAK manufactured by onsemi. The manufacturer part number is FQB34P10TM. It has a maximum of 100 v drain source voltage. With a typical gate charge at Vgs includes 85 nc @ 10 v. The product is available in surface mount configuration. The product carries enhancement channel mode. Provides up to 3.75 w maximum power dissipation. It features a maximum gate source voltage of -25 v, +25 v. In addition, the height is 4.83mm. Furthermore, the product is 9.65mm wide. Its accurate length is 10.67mm. Whereas its minimum gate threshold voltage includes 2v. The package is a sort of d2pak (to-263). It consists of 1 elements per chip. Whereas, the minimum operating temperature of the product is -55 °c. While 33 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. It provides up to 60 mω maximum drain source resistance. The product is available in [Cannel Type] channel. It has a maximum operating temperature of +175 °c. It contains 3 pins. The product offers single transistor configuration. It is assigned with possible HTSUS value of 8541.29.0095. The typical Vgs (th) (max) of the product is 4v @ 250µa. The product has -55°c ~ 175°c (tj) operating temperature range. Moreover, the product comes in to-263-3, d2pak (2 leads + tab), to-263ab. It has a maximum Rds On and voltage of 60mohm @ 16.75a, 10v. The maximum gate charge and given voltages include 110 nc @ 10 v. The product is rohs3 compliant. In addition, it is reach unaffected. It carries FET type p-channel. The drive voltage (maximum and minimum Rds On) of the product includes 10v. It is shipped in tape & reel (tr) package . The product has a 100 v drain to source voltage. The maximum Vgs rate is ±25v. Its typical moisture sensitivity level is 1 (unlimited). The product carries maximum power dissipation 3.75w (ta), 155w (tc). The product's input capacitance at maximum includes 2910 pf @ 25 v. The product qfet®, is a highly preferred choice for users. to-263 (d2pak) is the supplier device package value. The continuous current drain at 25°C is 33.5a (tc). This product use mosfet (metal oxide) technology. Moreover, it corresponds to fqb34p10, a base product number of the product. The product is designated with the ear99 code number.

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FQB34P10, P-Channel QFET MOSFET 100V -33.5A, 60mOhm(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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onsemi RoHS(Environmental Information)
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Mult Dev Wafer Fab/Site Transfer 02/Jan/2024(PCN Assembly/Origin)
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Logo 17/Aug/2017(PCN Design/Specification)
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Postponed Qualification 27/Dec/2022(PCN Design/Specification)
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FQB34P10(Datasheets)
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Mult Dev Box Chgs 1/Jul/2021(PCN Packaging)
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Mult Devices 24/Oct/2017(PCN Packaging)

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