P-Channel MOSFET, 2.7 A, 500 V, 3-Pin TO-220AB onsemi FQP3P50

FQP3P50 P-Channel MOSFET, 2.7 A, 500 V, 3-Pin TO-220AB onsemi
FQP3P50
onsemi

Product Information

Maximum Continuous Drain Current:
2.7 A
Transistor Material:
Si
Width:
4.7mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
500 V
Package Type:
TO-220AB
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
3V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
18 nC @ 10 V
Channel Type:
P
Length:
10.1mm
Pin Count:
3
Channel Mode:
Enhancement
Mounting Type:
Through Hole
Maximum Power Dissipation:
85 W
Series:
QFET
Maximum Gate Source Voltage:
-30 V, +30 V
Height:
9.4mm
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
4.9 Ω
FET Feature:
-
HTSUS:
8541.29.0095
Vgs(th) (Max) @ Id:
5V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
TO-220-3
Rds On (Max) @ Id, Vgs:
4.9Ohm @ 1.35A, 10V
Gate Charge (Qg) (Max) @ Vgs:
23 nC @ 10 V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Unaffected
edacadModel:
FQP3P50 Models
FET Type:
P-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
edacadModelUrl:
/en/models/1055021
Package:
Tube
Drain to Source Voltage (Vdss):
500 V
Vgs (Max):
±30V
Moisture Sensitivity Level (MSL):
Not Applicable
Power Dissipation (Max):
85W (Tc)
Input Capacitance (Ciss) (Max) @ Vds:
660 pF @ 25 V
standardLeadTime:
48 Weeks
Mounting Type:
Through Hole
Series:
QFET®
Supplier Device Package:
TO-220-3
Current - Continuous Drain (Id) @ 25°C:
2.7A (Tc)
Technology:
MOSFET (Metal Oxide)
Base Product Number:
FQP3
ECCN:
EAR99
RoHs Compliant
Checking for live stock

This is P-Channel MOSFET 2.7 A 500 V 3-Pin TO-220AB manufactured by onsemi. The manufacturer part number is FQP3P50. While 2.7 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 4.7mm wide. The product offers single transistor configuration. It has a maximum of 500 v drain source voltage. The package is a sort of to-220ab. It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 3v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 18 nc @ 10 v. The product is available in [Cannel Type] channel. Its accurate length is 10.1mm. It contains 3 pins. The product carries enhancement channel mode. The product is available in through hole configuration. Provides up to 85 w maximum power dissipation. The product qfet, is a highly preferred choice for users. It features a maximum gate source voltage of -30 v, +30 v. In addition, the height is 9.4mm. Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 4.9 ω maximum drain source resistance. It is assigned with possible HTSUS value of 8541.29.0095. The typical Vgs (th) (max) of the product is 5v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in to-220-3. It has a maximum Rds On and voltage of 4.9ohm @ 1.35a, 10v. The maximum gate charge and given voltages include 23 nc @ 10 v. The product is rohs3 compliant. In addition, it is reach unaffected. It carries FET type p-channel. The drive voltage (maximum and minimum Rds On) of the product includes 10v. It is shipped in tube package . The product has a 500 v drain to source voltage. The maximum Vgs rate is ±30v. Its typical moisture sensitivity level is not applicable. The product carries maximum power dissipation 85w (tc). The product's input capacitance at maximum includes 660 pf @ 25 v. It has a long 48 weeks standard lead time. The product qfet®, is a highly preferred choice for users. to-220-3 is the supplier device package value. The continuous current drain at 25°C is 2.7a (tc). This product use mosfet (metal oxide) technology. Moreover, it corresponds to fqp3, a base product number of the product. The product is designated with the ear99 code number.

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FQP3P50, P-Channel QFET MOSFET 500V -2.7A, 4.9 Ohm(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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onsemi RoHS(Environmental Information)
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Wafer Fab Change 27/Sep/2022(PCN Assembly/Origin)
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Logo 17/Aug/2017(PCN Design/Specification)
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Postponed Qualification 27/Dec/2022(PCN Design/Specification)
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Mult Dev EOL 30/Mar/2023(PCN Obsolescence/ EOL)
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Mult Devices 24/Oct/2017(PCN Packaging)
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Tape and Box/Reel Barcode Update 07/Aug/2014(PCN Packaging)
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TO220B03 Pkg Drawing(Product Drawings)

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