Toshiba TK39N60X,S1F(S N-channel MOSFET, 38.8 A, 600 V DTMOSIV, 3-Pin TO-247

TK39N60X-S1F-S Toshiba TK39N60X,S1F(S N-channel MOSFET, 38.8 A, 600 V DTMOSIV, 3-Pin TO-247
TK39N60X,S1F(S
Toshiba

Product Information

Maximum Continuous Drain Current:
38.8 A
Transistor Material:
Si
Width:
5.02mm
Maximum Drain Source Voltage:
600 V
Maximum Gate Threshold Voltage:
3.5V
Package Type:
TO-247
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
2.5V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
85 nC @ 10 V
Channel Type:
N
Length:
15.94mm
Pin Count:
3
Channel Mode:
Enhancement
Mounting Type:
Through Hole
Maximum Power Dissipation:
270 W
Series:
DTMOSIV
Maximum Gate Source Voltage:
-30 V, +30 V
Height:
20.95mm
Forward Diode Voltage:
1.7V
Maximum Drain Source Resistance:
65 mΩ
RoHs Compliant
Checking for live stock

This is N-channel MOSFET 38.8 A 600 V DTMOSIV 3-Pin TO-247 manufactured by Toshiba. The manufacturer part number is TK39N60X,S1F(S. While 38.8 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 5.02mm wide. It has a maximum of 600 v drain source voltage. The product carries 3.5v of maximum gate threshold voltage. The package is a sort of to-247. It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 2.5v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 85 nc @ 10 v. The product is available in [Cannel Type] channel. Its accurate length is 15.94mm. It contains 3 pins. The product carries enhancement channel mode. The product is available in through hole configuration. Provides up to 270 w maximum power dissipation. The product dtmosiv, is a highly preferred choice for users. It features a maximum gate source voltage of -30 v, +30 v. In addition, the height is 20.95mm. Its forward diode voltage is 1.7v . It provides up to 65 mω maximum drain source resistance.

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TK39N60X,S1F(S(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)

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