Category:
Power MOSFET
Dimensions:
10.67 x 4.83 x 9.65mm
Maximum Continuous Drain Current:
140 A
Transistor Material:
Si
Width:
4.83mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
30 V
Maximum Drain Source Resistance:
7.5 mΩ
Package Type:
D2PAK (TO-263)
Number of Elements per Chip:
1
Maximum Operating Temperature:
+175 °C
Typical Gate Charge @ Vgs:
76 nC @ 4.5 V
Channel Type:
N
Typical Input Capacitance @ Vds:
3720 pF @ 25 V
Length:
10.67mm
Pin Count:
3
Forward Transconductance:
82S
Typical Turn-Off Delay Time:
29 ns
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
200 W
Series:
HEXFET
Maximum Gate Source Voltage:
-16 V, +16 V
Height:
9.65mm
Typical Turn-On Delay Time:
16 ns
Minimum Operating Temperature:
-55 °C
Forward Diode Voltage:
1.2V
