ON Semiconductor FDG6318P

FDG6318P ON Semiconductor
FDG6318P
FDG6318P
ON Semiconductor

Product Information

Maximum Continuous Drain Current:
500 mA
Transistor Material:
Si
Width:
1.25mm
Transistor Configuration:
Isolated
Maximum Drain Source Voltage:
20 V
Package Type:
SOT-363 (SC-70)
Number of Elements per Chip:
2
Minimum Gate Threshold Voltage:
0.65V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
0.86 nC @ 4.5 V
Channel Type:
P
Length:
2mm
Pin Count:
6
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
300 mW
Series:
PowerTrench
Maximum Gate Source Voltage:
-12 V, +12 V
Height:
1mm
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
1.2 Ω
FET Feature:
Logic Level Gate
Base Part Number:
FDG6318
Detailed Description:
Mosfet Array 2 P-Channel (Dual) 20V 500mA 300mW Surface Mount SC-88 (SC-70-6)
Input Capacitance (Ciss) (Max) @ Vds:
83pF @ 10V
Gate Charge (Qg) (Max) @ Vgs:
1.2nC @ 4.5V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Drain to Source Voltage (Vdss):
20V
Package / Case:
6-TSSOP, SC-88, SOT-363
Rds On (Max) @ Id, Vgs:
780mOhm @ 500mA, 4.5V
Supplier Device Package:
SC-88 (SC-70-6)
Packaging:
Cut Tape (CT)
Operating Temperature:
-55°C ~ 150°C (TJ)
FET Type:
2 P-Channel (Dual)
Customer Reference:
Power - Max:
300mW
Current - Continuous Drain (Id) @ 25°C:
500mA
Manufacturer:
ON Semiconductor
RoHs Compliant
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is FDG6318P. While 500 ma of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 1.25mm wide. The product offers isolated transistor configuration. It has a maximum of 20 v drain source voltage. The package is a sort of sot-363 (sc-70). It consists of 2 elements per chip. Whereas its minimum gate threshold voltage includes 0.65v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 0.86 nc @ 4.5 v. The product is available in [Cannel Type] channel. Its accurate length is 2mm. It contains 6 pins. The product carries enhancement channel mode. The product is available in surface mount configuration. Provides up to 300 mw maximum power dissipation. The product powertrench, is a highly preferred choice for users. It features a maximum gate source voltage of -12 v, +12 v. In addition, the height is 1mm. Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 1.2 ω maximum drain source resistance. The FET features of the product include logic level gate. Base Part Number: fdg6318. It features mosfet array 2 p-channel (dual) 20v 500ma 300mw surface mount sc-88 (sc-70-6). The product's input capacitance at maximum includes 83pf @ 10v. The maximum gate charge and given voltages include 1.2nc @ 4.5v. The typical Vgs (th) (max) of the product is 1.5v @ 250µa. The product has a 20v drain to source voltage. Moreover, the product comes in 6-tssop, sc-88, sot-363. It has a maximum Rds On and voltage of 780mohm @ 500ma, 4.5v. sc-88 (sc-70-6) is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The product has -55°c ~ 150°c (tj) operating temperature range. It carries FET type 2 p-channel (dual). The maximum power of the product is 300mw. The continuous current drain at 25°C is 500ma. The on semiconductor's product offers user-desired applications.

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FDG6318P, Dual P-Channel, Digital FET Data Sheet(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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1Q2018 Product EOL 31/Mar/2018(PCN Obsolescence/ EOL)
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FDG6318P(Datasheets)
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Mold Compound 12/Dec/2007(PCN Design/Specification)
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Mold Compound 07/May/2008(PCN Design/Specification)
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Binary Year Code Marking 15/Jan/2014(PCN Packaging)
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Mult Devices 24/Oct/2017(PCN Packaging)

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