Maximum Continuous Drain Current:
2.5 A
Transistor Material:
Si
Width:
15.8mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
1500 V
Maximum Gate Threshold Voltage:
5V
Package Type:
H2PAK-2
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
3V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
29.3 nC @ 10 V
Channel Type:
N
Length:
10.4mm
Pin Count:
3
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
140 W
Series:
MDmesh
Maximum Gate Source Voltage:
-30 V, +30 V
Height:
4.8mm
Maximum Drain Source Resistance:
9 Ω
FET Feature:
-
HTSUS:
8541.29.0095
RoHS Status:
ROHS3 Compliant
Operating Temperature:
150°C (TJ)
Package / Case:
TO-263-3, D2PAK (2 Leads + Tab), Variant
Rds On (Max) @ Id, Vgs:
9Ohm @ 1.3A, 10V
title:
STH3N150-2
Vgs(th) (Max) @ Id:
5V @ 250µA
REACH Status:
REACH Unaffected
edacadModel:
STH3N150-2 Models
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
edacadModelUrl:
/en/models/4250811
Drain to Source Voltage (Vdss):
1500 V
Vgs (Max):
±30V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Power Dissipation (Max):
140W (Tc)
standardLeadTime:
14 Weeks
Input Capacitance (Ciss) (Max) @ Vds:
939 pF @ 25 V
Mounting Type:
Surface Mount
Series:
PowerMESH™
Gate Charge (Qg) (Max) @ Vgs:
29.3 nC @ 10 V
Supplier Device Package:
H2PAK
Packaging:
Tape & Reel (TR)
Current - Continuous Drain (Id) @ 25°C:
2.5A (Tc)
Technology:
MOSFET (Metal Oxide)
Base Product Number:
STH3N150
ECCN:
EAR99
