USB:
USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
RoHS Status:
ROHS3 Compliant
Number of Cores/Bus Width:
8 Core, 64-Bit
Supplier Device Package:
1313-BGA (29x29)
Additional Interfaces:
CANbus, I2C, SPI, UART
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
1313-BFBGA
Co-Processors/DSP:
Multimedia; NEON
REACH Status:
REACH Unaffected
RAM Controllers:
LPDDR4
Manufacturer:
NXP USA Inc.
Security Features:
A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Ethernet:
1Gbps (2)
standardLeadTime:
26 Weeks
Graphics Acceleration:
Yes
Display & Interface Controllers:
DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Mounting Type:
Surface Mount
Series:
i.MX8Q
Voltage - I/O:
1.8V, 2.5V, 3.3V
Packaging:
Tape & Reel (TR)
SATA:
-
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Speed:
1.6GHz, 1.2GHz, 264MHz