USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
RoHS Status:
ROHS3 Compliant
Number of Cores/Bus Width:
3 Core, 64-Bit
Supplier Device Package:
609-FBGA (21x21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
609-BFBGA
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
title:
MIMX8DX5AVLFZACR
REACH Status:
REACH Unaffected
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Manufacturer:
NXP USA Inc.
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Ethernet:
10/100/1000Mbps (2)
standardLeadTime:
26 Weeks
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Mounting Type:
Surface Mount
Series:
i.MX8Q
Voltage - I/O:
1.8V, 2.5V, 3.3V
Packaging:
Tape & Reel (TR)
SATA:
-
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Speed:
1.2GHz, 264MHz
