USB:
USB 2.0 OTG + PHY (1)
HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Number of Cores/Bus Width:
2 Core, 64-Bit
Supplier Device Package:
306-TFBGA (11x11)
Additional Interfaces:
AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Operating Temperature:
-40°C ~ 105°C (TJ)
Package / Case:
306-TFBGA
Co-Processors/DSP:
Multimedia; NEON™ MPE
REACH Status:
REACH Unaffected
RAM Controllers:
DDR3L, DDR4, LPDDR4
Manufacturer:
NXP USA Inc.
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Ethernet:
GbE
standardLeadTime:
16 Weeks
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI
Mounting Type:
Surface Mount
Series:
i.MX8MN
Voltage - I/O:
-
Packaging:
Tray
SATA:
-
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Speed:
1.4GHz
Base Product Number:
MIMX8MN1
ECCN:
5A992C