RoHS Status:
ROHS3 Compliant
Package / Case:
320-LFBGA
Number of I/O:
195
Operating Temperature:
-40°C ~ 125°C (TA)
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Program Memory Size:
8.188MB (8.188M x 8)
RAM Size:
1M x 8
Packaging:
Tape & Reel (TR)
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, Temp Sensor, WDT
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
Connectivity:
eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART
EEPROM Size:
256K x 8
Oscillator Type:
External, Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
DigiKey Programmable:
Not Verified
Core Size:
32-Bit Quad-Core
Mounting Type:
Surface Mount
Series:
Traveo™ T2G
Supplier Device Package:
320-BGA (17x17)
Data Converters:
A/D 114x12b SAR
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Speed:
100MHz, 350MHz
