NXP USA Inc. LPC5536JBD100E

LPC5536JBD100E NXP USA Inc.
LPC5536JBD100E
NXP USA Inc.

Product Information

HTSUS:
8542.31.0025
RoHS Status:
ROHS3 Compliant
Program Memory Size:
256KB (256K x 8)
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Operating Temperature:
-40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Package / Case:
100-LQFP
RAM Size:
128K x 8
Data Converters:
A/D 23x16b; D/A 2x12b
title:
LPC5536JBD100E
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
edacadModel:
LPC5536JBD100E Models
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
edacadModelUrl:
/en/models/16285450
EEPROM Size:
-
Oscillator Type:
External, Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Qualification:
-
Number of I/O:
66
standardLeadTime:
13 Weeks
DigiKey Programmable:
Not Verified
Core Size:
32-Bit Single-Core
Mounting Type:
Surface Mount
Grade:
-
Series:
-
Supplier Device Package:
100-HLQFP (14x14)
Packaging:
Tray
Core Processor:
ARM® Cortex®-M33
Speed:
150MHz
Base Product Number:
LPC5536
ECCN:
3A991A2
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This is manufactured by NXP USA Inc.. The manufacturer part number is LPC5536JBD100E. It is assigned with possible HTSUS value of 8542.31.0025. The product is rohs3 compliant. In addition, 256kb (256k x 8) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, dma, i2s, por, pwm, wdt. The product has -40°c ~ 105°c (ta) operating temperature range. The supply voltage of a bespoke product includes 1.8v ~ 3.6v. Moreover, the product comes in 100-lqfp. The product has typical 128k x 8 RAM size. The typical data converters include a/d 23x16b; d/a 2x12b. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through can fd, flexcomm, i2c, i3c, spi, uart/usart, usb2.0. The product is a external, internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 66 is the I/O value of the product. It has a long 13 weeks standard lead time. It has a core size 32-bit single-core. The product is available in surface mount configuration. 100-hlqfp (14x14) is the supplier device package value. In addition, tray is the available packaging type of the product. arm® cortex®-m33 is the product's core processor. It has a robust speed of 150mhz. Moreover, it corresponds to lpc5536, a base product number of the product. The product is designated with the 3a991a2 code number.

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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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LPC55(S)3y Wafer Fab 18/Jul/2024(PCN Assembly/Origin)
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Datasheet Update 23/Nov/2022(PCN Design/Specification)
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LPC553x 04/May/2024(PCN Design/Specification)
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LPC553x Datasheet(Datasheets)
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LPCx/PRH601HLx/PXAH30KFBEx 01/Jun/2022(PCN Packaging)

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