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This is manufactured by NXP USA Inc.. The manufacturer part number is LPC55S66JBD100K. It is assigned with possible HTSUS value of 8542.31.0025. The product is rohs3 compliant. In addition, 256kb (256k x 8) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, dma, i2s, por, pwm, rng, wdt. The product has -40°c ~ 105°c (ta) operating temperature range. The supply voltage of a bespoke product includes 1.8v ~ 3.6v. Moreover, the product comes in 100-lqfp exposed pad. The product has typical 144k x 8 RAM size. The typical data converters include a/d 10x16b. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through flexcomm, i2c, mmc/sd/sdio, spi, uart/usart, usb. The product is a internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 64 is the I/O value of the product. It has a long 13 weeks standard lead time. It has a core size 32-bit dual-core. The product is available in surface mount configuration. The product lpc55s6x, is a highly preferred choice for users. 100-hlqfp (14x14) is the supplier device package value. In addition, tray is the available packaging type of the product. arm® cortex®-m33 is the product's core processor. It has a robust speed of 150mhz. Moreover, it corresponds to lpc55s66, a base product number of the product. The product is designated with the 5a992c code number.
For more information please check the datasheets.
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