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This is manufactured by NXP USA Inc.. The manufacturer part number is SPC5775BDK3MME2. It is assigned with possible HTSUS value of 8542.31.0025. The product is rohs3 compliant. In addition, 4mb (4m x 8) is the program memory size. It has supplied with other peripherals, such as dma, lvd, por, zipwire. The product has -40°c ~ 125°c (ta) operating temperature range. The supply voltage of a bespoke product includes 3v ~ 5.5v. Moreover, the product comes in 416-bga. The product has typical 512k x 8 RAM size. In addition, tray is the available packaging type of the product. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through canbus, ebi/emi, ethernet, flexcanbus, linbus, sci, spi. The product is a external type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 293 is the I/O value of the product. It has a long 12 weeks standard lead time. It has a core size 32-bit dual-core. The product is available in surface mount configuration. The product mpc57xx, is a highly preferred choice for users. 416-mapbga (27x27) is the supplier device package value. The typical data converters include a/d 40x12b eqadcx2. e200z7 is the product's core processor. It has a robust speed of 220mhz. Moreover, it corresponds to spc5775, a base product number of the product. The product is designated with the 5a992c code number.
For more information please check the datasheets.
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