NXP USA Inc. MC9S08MM32CLH

MC9S08MM32CLH NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
32KB (32K x 8)
Peripherals:
LVD, POR, PWM, WDT
Operating Temperature:
-40°C ~ 85°C (TA)
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Package / Case:
64-LQFP
RAM Size:
4K x 8
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
Connectivity:
I2C, SCI, SPI, USB
Package:
Tray
EEPROM Size:
-
Oscillator Type:
Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Number of I/O:
33
DigiKey Programmable:
Not Verified
Core Size:
8-Bit
Mounting Type:
Surface Mount
Series:
S08
Supplier Device Package:
64-LQFP (10x10)
Data Converters:
A/D 6x16b; D/A 1x12b
Core Processor:
S08
Speed:
48MHz
Base Product Number:
MC9S08
ECCN:
3A991A2
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This is manufactured by NXP USA Inc.. The manufacturer part number is MC9S08MM32CLH. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. In addition, 32kb (32k x 8) is the program memory size. It has supplied with other peripherals, such as lvd, por, pwm, wdt. The product has -40°c ~ 85°c (ta) operating temperature range. The supply voltage of a bespoke product includes 1.8v ~ 3.6v. Moreover, the product comes in 64-lqfp. The product has typical 4k x 8 RAM size. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through i2c, sci, spi, usb. It is shipped in tray package . The product is a internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 33 is the I/O value of the product. It has a core size 8-bit. The product is available in surface mount configuration. The product s08, is a highly preferred choice for users. 64-lqfp (10x10) is the supplier device package value. The typical data converters include a/d 6x16b; d/a 1x12b. s08 is the product's core processor. It has a robust speed of 48mhz. Moreover, it corresponds to mc9s08, a base product number of the product. The product is designated with the 3a991a2 code number.

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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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Polyimide Removal 14/Aug/2013(PCN Design/Specification)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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